Chipmakers to boost 300mm fab capacity to all-time high in 2026

According to SEMI, semiconductor manufacturers are predicted to increase 300mm fab capacity to a record high of 9.6 million wafers per month in 2026. Although the pace of expansion is slowing, the industry remains committed to meeting the growing demand for semiconductors. Major drivers of this capacity increase are expected to be the foundry, memory, and power sectors. Notable chipmakers planning to enhance their 300mm fab capacity include Intel, Samsung, TSMC, and more, with 82 new facilities and lines scheduled from 2023 to 2026. China's government investments in mature technology are anticipated to boost its global share to 25%, while Korea, Taiwan, and Japan might see slight dips. In contrast, the Americas and Europe & Mideast are poised for growth in fab capacity share, driven by automotive demand and government investments. The report also highlights that analog and power sectors will experience the most capacity growth.